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IT8586E (FXA)
IT8586E (FXA)
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet.
Product Description
Technical Support:
- BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
- BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet.
Lead-free/No Pb BGA chips:
- 245C-260C(Maximun)
Leaded/Pb BGA chips:
- 180C-205C(Maximun)
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