IT8586E (FXA)

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet.

SKU: SLY-IC190 Category:
Description

Product Description

Technical Support:

  • BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
  • BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet.

 

Lead-free/No Pb BGA chips:

  • 245C-260C(Maximun)

Leaded/Pb BGA chips:

  • 180C-205C(Maximun)
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