VS27 Stencil BGA

Mechanical BGA Reballing Stencil Template 0.3/0.35/0.4/0.5mm For Vivo OPPO BT Wifi RF Series Chip EMMC PMIC Power IC Steel Net

SKU: SLY-BGA36-4 Category:

Product Description


  • Color: As the picture shows
  • Type: BGA Reballing Stencil Template
  • Design: steel plate 100%: high quality
  • Application: for huawei xiaomi motherboard repair bga rebalance
  • Unit Type: piece
  • Suit for: for BT Wifi RF series chip/EMMC/Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic cpu bga rebalance
  • Function: phone bga reballing kit for rework station


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