VS05 Stencil BGA
Mechanical BGA Reballing Stencil Template 0.3/0.35/0.4/0.5mm For Vivo OPPO BT Wifi RF Series Chip EMMC PMIC Power IC Steel Net:
- Color: As the picture shows
- Type: BGA Reballing Stencil Template
- Design: steel plate 100%: high quality
- Application: for huawei xiaomi motherboard repair bga rebalance
- Unit Type: piece
- Suit for: for BT Wifi RF series chip/EMMC/Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic cpu bga rebalance
- Function: phone bga reballing kit for rework station
Product Description
DETAILS:
- Color: As the picture shows
- Type: BGA Reballing Stencil Template
- Design: steel plate 100%: high quality
- Application: for huawei xiaomi motherboard repair bga rebalance
- Unit Type: piece
- Suit for: for BT Wifi RF series chip/EMMC/Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic cpu bga rebalance
- Function: phone bga reballing kit for rework station
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