Characteristic:

• These stencils can be heated by the hot air machine, it is easy and quick to repack the BGA IC.
• Solve the problem when computer maintenance engineers use direct-heated steel mesh. Durable in use.
• High success rate of tin planting, solder balls can be formed once when you are proficient.
• Simple and practical to use.
• BGA rewrapping stencil only, other accessories demonstration in the picture is not included!

Specifications:

• Item Type: BGA Reballing Stencil
• Material: Stainless Steel
• Size: Standard Size