STATION BGA MANUAL WDS-580
Bga station IR mobile preheater ic repair tools reballing machine
Demo video: https://youtu.be/Djb0tCsA9Ck
BGA Rework Station Application
1) laptop/notebook/computer motherboard repair.
2) Repair of Playstation / XBOX 360 and other game consoles.
3) iPhone series such as 4/ 4s / 5 / 5s/ 6 / 6s / 6s plus/ 7 / 8 and other smart phone motherboard repair.
4) TV/video/ipad motherboard repai.
5) SMD/ SMT / IC BGA rework
WDS-580 BGA Rework Station Parameter
|High Power Heating||800W|
|Low Heating Power||Second zone: 1200W, third zone: IR 2700W|
|Food||AC 110V/220V±10% 500HZ|
|Locate Mode||V-shaped card slot, adjustable PCB holder
By X and Y axesWith universal jigs
|Temperature control||Closed-loop control of K-type thermocouple, independent temperature control, accuracy up to± 3 degrees|
|PCB Size||Max 400*370mm, Min 10*10mm|
|Electrical Material||Touch screen + temperature control module + PLC control|
WDS-580 IC Replacement Machine Features
1. Adopted with linear slider, so the three axes (X, Y and Z) can do fine adjustment and quick orientation with perfect positioning accuracy and fast maneuverability.
2. Equipped with touch screen interface and PLC control to ensure its stable and reliable operation. And it can store multiple temperature profile data of users. With password protection and modification function during power-on. The temperature profiles will be displayed on the touch screen.
3. Three temperature zones to heat independently, hot air heats between up and down zone, IR heats in the bottom, precise temperature control is within ±3℃. The upper temperature zone can be moved freely as needed, the second zone can be adjusted up and down. The upper and lower radiators can be set several control segments at the same time. The IR heating area can be adjusted according to operation requirements.
4. The hot air nozzle can be rotated 360 degrees, the IR radiator in the bottom can heat the PCB board evenly.
5. High precision K-type thermocouple closed-loop control. It can test the temperature accurately through an external temperature measurement interface, a PCB positioned by a closed V-shaped slot. The flexible and practical universal jigs can prevent any damage or deformation of the PCB and are suitable for all sizes of BGA packaging.
6. Large power fan to cool the PCB quickly. Built-in vacuum pump and external vacuum nozzle are able to remove BGA chips easily.
7. Have alarm prompt function when finished welding, specially added early warning function for convenient operation.
8. It has passed CE certificate. It is equipped with an emergency stop switch and protective equipment to automatically shut down in the event of an abnormal accident. In this situation where the temperature is out of control, the circuit can automatically cut off the power supply with double overheating protection function.