SKU: SLY-BGA04 Category:

Product Description

Bga station IR mobile preheater ic repair tools reballing machine
Demo video:
BGA Rework Station Application
1) laptop/notebook/computer motherboard repair.
2) Repair of Playstation / XBOX 360 and other game consoles.
3) iPhone series such as 4/ 4s / 5 / 5s/ 6 / 6s / 6s plus/ 7 / 8 and other smart phone motherboard repair.
4) TV/video/ipad motherboard repai.
5) SMD/ SMT / IC BGA rework
WDS-580 BGA Rework Station Parameter
Total power 4800W
High Power Heating 800W
Low Heating Power Second zone: 1200W, third zone: IR 2700W
Food AC 110V/220V±10% 500HZ
Overall dimension 500*590*H650mm
Locate Mode V-shaped card slot, adjustable PCB holder

By X and Y axesWith universal jigs

Temperature control Closed-loop control of K-type thermocouple, independent temperature control, accuracy up to± 3 degrees
PCB Size Max 400*370mm, Min 10*10mm
Electrical Material Touch screen + temperature control module + PLC control
Machine weight 40kg
WDS-580 IC Replacement Machine Features
1. Adopted with linear slider, so the three axes (X, Y and Z) can do fine adjustment and quick orientation with perfect positioning accuracy and fast maneuverability.
2. Equipped with touch screen interface and PLC control to ensure its stable and reliable operation. And it can store multiple temperature profile data of users. With password protection and modification function during power-on. The temperature profiles will be displayed on the touch screen.
3. Three temperature zones to heat independently, hot air heats between up and down zone, IR heats in the bottom, precise temperature control is within ±3℃. The upper temperature zone can be moved freely as needed, the second zone can be adjusted up and down. The upper and lower radiators can be set several control segments at the same time. The IR heating area can be adjusted according to operation requirements.
4. The hot air nozzle can be rotated 360 degrees, the IR radiator in the bottom can heat the PCB board evenly.
5. High precision K-type thermocouple closed-loop control. It can test the temperature accurately through an external temperature measurement interface, a PCB positioned by a closed V-shaped slot. The flexible and practical universal jigs can prevent any damage or deformation of the PCB and are suitable for all sizes of BGA packaging.
6. Large power fan to cool the PCB quickly. Built-in vacuum pump and external vacuum nozzle are able to remove BGA chips easily.
7. Have alarm prompt function when finished welding, specially added early warning function for convenient operation.
8. It has passed CE certificate. It is equipped with an emergency stop switch and protective equipment to automatically shut down in the event of an abnormal accident. In this situation where the temperature is out of control, the circuit can automatically cut off the power supply with double overheating protection function.



There are no reviews yet.

Be the first to review “STATION BGA MANUAL WDS-580”

Your email address will not be published. Required fields are marked *

Back to top