Product Description

FEATURES:

• Lead Free Finish/Rohs Compliant (Note1) (“P”Suffix designates Compliant. See ordering information)
• Glass Passivated Chip
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Maximum Thermal Resistance; 18°C/W Junction To Lead
• Halogen free available upon request by adding suffix “-HF”

Maximum Ratings:

• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Typical Thermal Resistance:
• 17°C/W Junction to Case 47°C/W Junction to Ambient 13°C/W Junction to Lead

Electrical Characteristics:

• Average Forward Current: IF(AV)= 10.0A
• Peak Forward Surge Current: IFSM= 200A
• Maximum Instantaneous Forward Voltage: VF= 1.20V
• Maximum DC Reverse Current At Rated DC Blocking Voltage: IR= 10μA