Product Description

 TECHNICAL SUPPORT :

• BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours.
• leaded (Pb) balls and lead free (No Pb) balls.
• Lead-free/No Pb BGA chips: 245C-260C(Maximun).
• Leaded/Pb BGA chips: 180C-205C(Maximun)