Product Description
SPECIFICATION:
- Module model: GY-BMP280-3.3
- Using chip: BMP280
- Power supply: 3V
- Communication mode: Standard IIC/SPI communication protocol
- Pressure range: 300-1100hPa
- Using turmeric PCB, machine welding process to ensure quality
- Pin spacing: 2.54mm
- Module size: 11.5mm*15mm
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