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BGA STENCIL FOR SAMSUNG S7

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1 Piece BGA IC Chip Reballing Stencil Kit Solder Template for Samsung S7:

Brand Name: SumSour
Origin: CN (Origin)
Certification: CE
Model Number: Stencils Particle
size: 1-10 μm

SKU: SLY-BGA33 Category: STENCIL BGA

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DETAILS:

Brand Name: SumSour
Origin: CN (Origin)
Certification: CE
Model Number: Stencils Particle

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