Mechanical BGA Reballing Stencil Template 0.3/0.35/0.4/0.5mm For Vivo OPPO BT Wifi RF Series Chip EMMC PMIC Power IC Steel Net;

• Color: As the picture shows
• Type: BGA Reballing Stencil Template
• Design: steel plate 100%: high quality
• Application: for huawei xiaomi motherboard repair bga rebalance
• Unit Type: piece
• Suit for: for BT Wifi RF series chip/EMMC/Vivo Oppo/0.3/0.35/0.4/0.5mm/PMIC power ic cpu bga rebalance
• Function: phone bga reballing kit for rework station