Product Description

DESCRIPTION:

• High efficiency, save electric repair time.
• Avoid heating pad damage at high temperature.
• Accurate design ensures maximum surface tension and tin absorption.
• Speed ​​up tin absorption and low flux residue.
• Improve the cleaning speed of PCB pad.
• Oxidation resistance and corrosion protection, good thermal conductivity.
• Tin absorption tape is a braided metal wire tape that can absorb molten solder by capillary action.
• It is used to absorb excess solder when removing tin.
• It is resistant to oxidation and corrosion.
• It has good thermal conductivity and good tin absorption.
• During desoldering, after the chip is removed, there will be a lot of solder on the circuit board, which will affect the soldering of the chip. It is usually cleaned with a suction tape.
• The method is to place the soldering iron on the suction tape and slowly move it on the chip pad. When the solder melts, it will be picked up by the tin suction tape.
• The printing plate is very clean. After that, wash the position of the chip on the machine board with washing water.

Note:

• In order to prevent scalds, please do not directly touch the tin suction wire during use, please hold the case or use tools such as tweezers.

Specifications:

• Material: ABS+copper.
• Use: this product is suitable for removing excess solder.
• Length: 1.5m.
• Width: 2.0, 2.5, 3.0, 3.5mm.
• Size: 46*46*11.5mm.