STM8S103F3P6 system board STM8S STM8 development board minimum core board

The development board using Micro USB cable power supply, compatible with smart phone lines, data lines are simple and easy to get, but not powered by Mini USB line.

SKU: SLY2025 Category:

Product Description

DESCRIPTION:

  • The development board using Micro USB cable power supply, compatible with smart phone lines, data lines are simple and easy to get, but not powered by Mini USB line.

STM8S mainboard main features:

  • Use STM8S103F3P6 as master IC.
  • You can use a 2.54 pin on the board or power supply, the buffer when using the power supply, the input voltage range 4.5V-15V, can output externally via the 3.3V pin.
  • Note: 5V pin voltage is the module input voltage.
  • Leads to all pins, pins next to label marked pin, with reset button, power LED and program shows LED, small but perfectly formed.
  • SWIM debug mode support.

Technical informations:

  • Motherboard schematics (PDF format) and tested source. Burned in the test program, the LED flashes, allowing you to detect that the motherboard is working properly
  • Provide IAR and STVD with two development environments recording the operation and routine operation of library functions. Timer routine, UART transmit routine, UART receive routines, clock switch routines, AD routines, etc.

STM8 Application:

  • STM8 package library.
  • IAR development environment, STVP programming software.

STM8S103F3P6 performance comparison:

  • STM8S003F3 chips only 128 bytes of EEPROM, STM8S103F3 640 bytes.
  • STM8S003F3 FLASH chip can only be erased 100 times, STM8S103F3 can erase ten thousand times STM8S103F2 FLASH chip only 4K bytes, STM8S103F3 have 8K bytes.

Conclusion:

  • STM8S003F3 is only suitable for mature products, STM8S003F3 motherboard is not suitable for development.
  • However STM8S103F3 is suitable for the development of the use of, our board of this development is the use of this chip
  • Size: 28mm*17mm*5mm.

Package Included:

  • 1 x STM8S103F3P6 system board.
 

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